This 32-pin surface-mount (SMT) PLCC socket provides a dedicated solderless interface for 32-lead rectangular J-lead IC chips on PCB pads. It allows engineers to mount and replace flash memory, EEPROMs, and microcontrollers without soldering heat, protecting chips from thermal reflow damage. The socket is widely used on industrial automation controllers, embedded development boards, and automotive electronics.
Key Features
- Available Positions: Standard options in 20, 28, 32, 44, 52, 68, and 84 pins.
- Mating Pitch: 1.27 mm (.050″) pitch for 32-lead J-lead PLCC packaged chips.
- Mounting Type: Surface mount (SMT) with standard PCB pad footprint.
- Thermal Endurance: High-temperature UL 94V-0 thermoplastic for reflow soldering.
- Solderless Swapping: Protects chips from soldering heat and enables fast field replacement.
Main Specifications:
General Information:
| Product No.: | PLCC-32-AT-SMT | |
| Product Type: | PLCC Sockets | |
| Number of Positions: | 32 (2 x 7, 2 x 9) | |
| Mounting Type: | Surface Mount | |
| Pitch – Mating: | 0.050″ (1.27mm) | |
| Pitch – Termination: | 0.100″ (2.54mm) | |
| Tail Length: | 0.126″ (3.20mm) |
Materials and Plating:
| Insulator Material: | Polybutylene Terephthalate (PBT), Glass Filled | |
| Insulator Color: | Brown | |
| Contact Material: | Phosphor Bronze | |
| Contact Plating: | Tin over Nickel | |
| Contact Finish Thickness: | 80.0µin (2.03µm) |
Electrical:
| Current rating: | 1 Amp max | |
| Operating voltage: | 250 VAC max | |
| Contact resistance: | 30 mohms max | |
| Insulation resistance: | 1000 Mohms min | |
| Dielectric withstanding voltage: | 500 VAC for 1 minute |
Environmental：
| Operating Temperature: | -55°C to +105°C | |
| Compliance: | Lead Free & RoHS Compliant |
PLCC Socket Dimensions
Applications:
- BIOS & Firmware Socketing
- Microcontroller (MCU) Development Boards
- IC Programming & Test Fixtures
- Industrial Automation Controllers
- Automotive Electronics & ECUs
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