DeMax Series High-Speed Backplane Connector System
Introduction:
The DeMax Series High-Speed Backplane System is a collection of high-density interconnect components intended for use in electronic devices requiring fast data transfers. It maintains two dependable points of contact at all times and minimizes residual stubs for better signal integrity performance. Meanwhile, it offers low mating force and excellent contact normal force. Signal wafers include a one-piece, embossed ground construction that reduces crosstalk. It Supports 64 Gbps PAM4 (32 Gbps NRZ) applications and is PICe® 6.0/CXL™ 3.1 capable.
The DeMAX Series is a high-performance electrical connector system designed for backplane, coplanar, and orthogonal applications. Backplane applications utilize a right-angle receptacle (EBTF-RA) and a vertical header (EBTM-VT). Coplanar and orthogonal applications use a right-angle header (EBTM-RA) and a right-angle receptacle (EBTF-RA).
Features of the DeMax Series High-Speed Backplane Connector System:
- Compatible with SAMTEC’s ExaMax series connectors;
- Meets industry specifications such as PCI Express®, Intel OPI and VPI, SAS, SATA, Fibre Channel, InfiniBand™ and Ethernet;
- 85Ω matched differential impedance for ensuring signal integrity;
- Meet bandwidth requirements ranging from 25Gbps to 56Gbps;
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications;
- PCIe®0/CXL™ 3.1 capable;
- Exceeds OIF CEI-28G-LR specification for 28 Gbps standards;
- 24 – 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns);
- Wafer design increases isolation for reduced crosstalk;
- Press-fit tails provide a reliable electrical connection.
Key Specifications:
| Product Type: | High-speed Board-to-board Connector | |
| Series: | EBTM/EBTF-RA/EBDM-RA | |
| Insulator Material: | Liquid Crystal Polymer | |
| Contact Material: | Copper Alloy | |
| Plating: | Sn or Au over 50 µ” (1.27 µm) Ni | |
| Temperature Range: | -55 °C to +105 °C | |
| Current Rating: | 4A per pin | |
| Voltage Rating: | 150V AC | |
| Lead-free Solderable: | Yes |
How to order:
DeMax 2.00 mm High-Speed Backplane Vertical & Right-angle Header: EBTM, EBTM-RA
Metabee DeMax 2.00 mm High-Speed Backplane Right-Angle Receptacle: EBTF-RA
DeMax 2.00 mm Direct Mate Orthogonal Header: EBDM-RA
Applications of the DeMax Series High-Speed Backplane Connector System:
The DeMax high-speed backplane system finds applications in various industries due to its ability to handle high data speeds and provide reliable connections. Here are some of the common applications:
- 5G Networking;
- Medical Devices;
- Automotive Industry;
- Industrial Automation;
- Test and Instrumentation;
- Military and Aerospace;
- Artificial Intelligence and Machine Learning.
Download Resources:
DeMax Series High-Speed Backplane Connector System Catalog (PDF, 1.1Mb)Factory pricing and exceptional product quality. OEM & ODM Services. Get a free quote now!
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