DeMax Series High-Speed Backplane Connector System

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DeMax Series High-Speed Backplane Connector System


The DeMax Series High-Speed Backplane System is a collection of high-density interconnect components intended for use in electronic devices requiring fast data transfers. It maintains two dependable points of contact at all times and minimizes residual stubs for better signal integrity performance. Meanwhile, it offers low mating force and excellent contact normal force. Signal wafers include a one-piece, embossed ground construction that reduces crosstalk. It Supports 64 Gbps PAM4 (32 Gbps NRZ) applications and is PICe® 6.0/CXL™ 3.1 capable.

The DeMAX Series is a high-performance electrical connector system designed for backplane, coplanar, and orthogonal applications. Backplane applications utilize a right-angle receptacle (EBTF-RA) and a vertical header (EBTM-VT). Coplanar and orthogonal applications use a right-angle header (EBTM-RA) and a right-angle receptacle (EBTF-RA).

Features of the DeMax Series High-Speed Backplane Connector System:

  • Compatible with SAMTEC’s ExaMax series connectors;
  • Meets industry specifications such as PCI Express®, Intel OPI and VPI, SAS, SATA, Fibre Channel, InfiniBand™ and Ethernet;
  • 85Ω matched differential impedance for ensuring signal integrity;
  • Meet bandwidth requirements ranging from 25Gbps to 56Gbps;
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications;
  • PCIe®0/CXL™ 3.1 capable;
  • Exceeds OIF CEI-28G-LR specification for 28 Gbps standards;
  • 24 – 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns);
  • Wafer design increases isolation for reduced crosstalk;
  • Press-fit tails provide a reliable electrical connection.

Key Specifications:

Product Type: High-speed Board-to-board Connector  
Insulator Material: Liquid Crystal Polymer  
Contact Material: Copper Alloy  
Plating: Sn or Au over 50 µ” (1.27 µm) Ni  
Temperature Range: -55 °C to +105 °C  
Current Rating: 4A per pin  
Voltage Rating: 150V AC  
Lead-free Solderable: Yes  

How to order:

DeMax 2.00 mm High-Speed Backplane Vertical & Right-angle Header: EBTM, EBTM-RA

DeMax Series High-speed Backplane Connector System - Part Numbers 01

Metabee DeMax 2.00 mm High-Speed Backplane Right-Angle Receptacle: EBTF-RA

DeMax 2.00 mm Direct Mate Orthogonal Header: EBDM-RA

Applications of the DeMax Series High-Speed Backplane Connector System:

The DeMax high-speed backplane system finds applications in various industries due to its ability to handle high data speeds and provide reliable connections. Here are some of the common applications:

  • 5G Networking;
  • Medical Devices;
  • Automotive Industry;
  • Industrial Automation;
  • Test and Instrumentation;
  • Military and Aerospace;
  • Artificial Intelligence and Machine Learning.

Download Resources:

DeMax Series High-Speed Backplane Connector System Catalog (PDF, 1.1Mb)

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Product Name

DeMax Series High-Speed Backplane Connector System





Insulator Material

Liquid Crystal Polymer

Contact Material

Copper Alloy


Sn or Au over 50 µ" (1.27 µm) Ni

Temperature range

-55 °C to +105 °C

Current Rating

4A per pin

Rated Voltage

150V AC

Lead-free Solderable


Other Features


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