This 32-pin through-hole PLCC socket provides a dedicated solderless interface for 32-lead rectangular J-lead IC chips on printed circuit boards. It allows engineers to mount and replace flash memory, EEPROMs, and microcontrollers without soldering heat, eliminating thermal risks during assembly and testing. The socket is widely used on industrial automation controllers, embedded development boards, and automotive electronics.
Key Features
- Available Positions: Standard options in 20, 28, 32, 44, 52, 68, and 84 pins.
- Mating Pitch: 1.27 mm (.050″) pitch for 32-lead J-lead PLCC packaged chips.
- Board Termination: Converts fine-pitch IC pins to a 2.54 mm (.100″) through-hole grid.
- Mounting Style: Vertical through-hole wave soldering with standard tail length.
- Solderless Swapping: Protects chips from soldering heat and enables fast field replacement.
Main Specifications:
General Information:
| Product No.: | PLCC-32-AT | |
| Product Type: | PLCC Sockets | |
| Number of Positions: | 32 (2 x 7, 2 x 9) | |
| Mounting Type: | Through Hole | |
| Pitch – Mating: | 0.050″ (1.27mm) | |
| Pitch – Termination: | 0.100″ (2.54mm) | |
| Tail Length: | 0.126″ (3.20mm) |
Materials and Plating:
| Insulator Material: | Polybutylene Terephthalate (PBT), Glass Filled | |
| Insulator Color: | Black | |
| Contact Material: | Phosphor Bronze | |
| Contact Plating: | Tin over Nickel | |
| Contact Finish Thickness: | 80.0µin (2.03µm) |
Electrical:
| Current rating: | 1 Amp max | |
| Operating voltage: | N/A | |
| Contact resistance: | 30 mohms max | |
| Insulation resistance: | 1000 Mohms min | |
| Dielectric withstanding voltage: | 500 VAC for 1 minute |
Environmental：
| Operating Temperature: | -50°C to +105°C | |
| Compliance: | Lead Free & RoHS Compliant |
PLCC Socket Dimensions
Applications:
- BIOS & Firmware Socketing
- Microcontroller (MCU) Development Boards
- IC Programming & Test Fixtures
- Industrial Automation Controllers
- Automotive Electronics & ECUs
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